Cost-Effective and Practical BGA / SMT
Rework Solutions
Remove, Replace and Clean BGA / SMT
Components for both Eutectic and Lead Free Solders
offers cost effective manual and
semi-automated BGA / SMT rework stations, from DEN-ON Instruments, a worldwide
leader of rework stations and soldering tools.
For over 25 years, DEN-ON
has been developing BGA / SMT rework equipment for the electronic industries
worldwide. As the electronics industry has been faced with rapidly changing
technology, DEN-ON has continued to introduce new rework equipment to match the
latest trends in electronics manufacturing, including advanced rework stations
for the removal and placement of BGA, Flip Chip, CSP, micro SMD components as
well as leading in rework heating technology to meet the demands of lead free
rework. For Lead Free rework, the Denon RD-500 Series is
unmatched.
RD-500 Large Board
RD-500SH
Standard Board
RD-500S
Small Board
BGA / SMT Rework Station
BGA / SMT
Rework Station
BGA / SMT Rework Station
RD-300 Manual
SD-3000 Nozzle-free
SC-200
Eutectic & Lead Free
BGA / SMT Rework Station
BGA / SMT Rework Station
Solder Scavengers
SC-7000Z
SS-8100 (D)
Nozzles / Board & Part
Holders
De-Soldering
Tool
Soldering
Station
Fixed / Adjustable /
Custom
■RD-500II
DEN-ON REWORK SYSTEM
BGA·CSP·LGA·QFP·PLCC rework.
안정된 작업을
위해서! ●오토 프로파일 ●각종 기구의 자동화 ●강력한 히터 ●PC컨트롤
■개요·특징 RD-500 II는 강력한 톱＆보텀 가열용의 핫 에어 히터와 가열시의 기판의 휘어진
상태를 방지하기 위한 에리어 가열용 IR히터를 갖추어 특히 납프리 반전을 사용한 BGA, GSP등의 에리어 어레이 부품의 리워크 작업시에 안정된
성능을 발휘합니다.가열은 컴퓨터 제어에 의해서 정확하게 행해져 또 온도 프로파일을, 자동적으로 작성하는 기능도 포함되어 있습니다. 600×500
mm의 대형 기판에도 대응 가능합니다.
부품 흡착, 탑재는 과열 노즐내의 진공 핀셋이 자동적으로 실시해, 번거로운 수작업은 모두 불필요합니다.프로파일은
각 히터 독립으로, 톱＆보텀 히터를 5 존, 에리어 히터 2 존의 설정이 가능하고, 어떠한 조건에 대해서도, 유연에 대응할 수 있습니다.또,
데이터의 관리 운용에 대해서는, 최신의 WindowsME로 대응합니다.
위치 맞춤은, PC화면상에서 합성된, 부품면과 기판면의 맞댐 포함에 의해 실시합니다.(이 때 편리한 대각부 확대
기능을 가지고 있습니다.)
부품 탑재시의 가압력은, 적정치(70~100 g)가 항상 유지되는, 안정된 슬립 기구를 채용해, 어떠한 기판,
부품에 대해서도 안심입니다.
■개요·특징 RD-500 SII는 강력한 톱＆보텀 가열용의 핫 에어 히터와 가열시의 기판의
휘어진 상태를 방지하기 위한 에리어 가열용 IR히터(옵션)를 갖추어 특히 납프리 반전을 사용한 BGA, CSP등의 에리어 어레이 부품의 리워크
작업시에 안정된 성능을 발휘합니다.가열은 컴퓨터 제어에 의해서 정확하게 행해져 또 온도 프로파일을, 자동적으로 작성하는 기능도 포함되어
있습니다.420×400 mm의 대형 기판에도 대응 가능합니다.
부품 흡착, 탑재는 과열 노즐내의 진공 핀셋이 자동적으로 실시해, 번거로운 수작업은 모두 불필요합니다.프로파일은
각 히터 독립으로, 톱＆보텀 히터를 5 존, 에리어 히터 2 존의 설정이 가능하고, 어떠한 조건에 대해서도, 유연에 대응할 수 있습니다.또,
데이터의 관리 운용에 대해서는, 최신의 WindowsXP로 대응합니다.
위치 맞춤은, PC화면상에서 합성된, 부품면과 기판면의 맞댐 포함에 의해 실시합니다.(이 때 편리한 대각부 확대
기능을 가지고 있습니다.)
부품 탑재시의 가압력은, 적정치(70~100 g)가 항상 유지되는, 안정된 슬립 기구를 채용해, 어떠한 기판,
부품에 대해서도 안심입니다.
■개요
본시스템은 위치 결정부와 리플로우부로 구성되어 있습니다.광학부는 색표현과 해상도의 좋은 현미경의 채용으로 정확 용이한
위치 결정이 생깁니다.리플로우부는 임의의 패턴의 온도 프로파일을 설정할 수 있어서 안정된 리플로우를 가능하게 하고 있습니다.한층 더 설정한
다종의 프로파일을 메모리 할 수도 있습니다.또, 최적인 열환경을 만들기 위한 강력한 원적외선 프리히타를 내장하고
있습니다.
■특징 ·온도 프로파일의 설정은, 푸쉬 SW의 조작으로 용이하게 할 수 있어 액정 표시부에
표시됩니다. ·리플로우의 경과는 인디케이터 램프에 의해 표시되어 작업의 현상을 간단하게 확인할 수 있습니다. ·현미경의 채용으로 소형
SMD등의 위치 결정이 확실합니다. ·여유가 있는 히터와 특수 구조의 노즐의 채용으로, 온도 분포의 균일성을 재고
있습니다. ·프리히타는 가열 면적이 큰 원적외선 히터를 사용해, 기판의 휘어진 상태를 방지해 리플로우를 확실히 합니다. ·압축기·진공
펌프 내장이므로, 외부 공급 에어는 불필요합니다.
■SD-3000
DEN-ON SMD REWORK
STATION
스포트 에어 방식“SMD 리워크
장비” 간단 조작으로 실패가 없습니다
■개요 본기는 다종 형상의 QFP.SOP.PLCC.SOJ.BGA.코넥터 DIP등의 제거 작업 및
납땜 작업에 노즐·헤트드 교환 없이 대응해, 비접촉 방식이므로 트러블이 없습니다.타이머를 내장하고 있기 때문에 어떤 분이라도 안심해 사용할 수
있습니다.노즐의 X.Y 방향 트레이스폭은, 0~50 mm의 범위에서 임의로 설정할 수 있습니다. 모드를 전환일에 의해 다양한 작업에 응용할 수
있습니다.
■특징 ·노즐·헤드 교환 없이 50 mm각까지의 모든 SMD에 대응합니다. ·노즐·에 드
교환 없이 50 mm각까지의 BGA의 제외를 할 수 있습니다. ·코넥터등의 제외도 할 수 있습니다. ·QFP.BGA등의 리플로우에도
대응했습니다. ·타이머의 채용에 의해 가열 오버에 의한 기판급주변 부품에의 다메지를 막습니다. ·마이크로후로셋서에 의한 자동화로
어떤 분이라도 실패가 없는 작업을 할 수 있습니다. ·경량 한편 컴팩트합니다. ·그 밖에 예가 없는 Low cost
제품입니다.
■특징과
이점 ·120 W의 히테잉에레먼트의 온도 제어에 의해서, 가장 조건의 나쁜 SMT의 연속 반전 제거를 실시하고 있는
동안에서도, 뛰어난 하이파워와 온도 복귀성을 발휘해, 팁을 거의 설정 온도에 유지합니다. ·클리닝중도 핫 에어의 토출을 계속하고 있기
때문에, 팁을 땜납 접합부나 땜납 패드로 이동하기 전에는 다 부를 프리히트 하는 것이 가능합니다.한편 이 핫 에어는, 땜납 제거를 실시하고 있는
동안, 팁이 식는 것을 막습니다.더욱 땜납힐도 막습니다. ·SC200(펌프 내장)와 SC300(공장 에어/venturi식)의 양 비행기종
모두 N2에 대응할 수 있습니다.
퀵 히트 회로를 채용한 고도의 온조 회로를
내장하고 있습니다. 안정된 능률이 좋은 납땜 작업을 약속 합니다.
성능·규격·쓰기 쉬움·안정성을 철저하게 추궁했습니다.
■특징 ·퀵 히트 회로의 채용과 특수 설계 히터의 채용으로, 양호한 온도립 오름·회복의 특성을
가지고 있습니다. ·스테이션 타입과 동등의 성능을 확보하고 있습니다.게다가 소형 경량입니다. ·ESD SAFE(안티 스태틱)
대책품입니다. ·팁은 장수화를 위해서 철도금을 종래의 2배(500미크론)로
했습니다.
■MIL
STD-2000 적합품 소형화된 PCB, 특히 SMT의 납땜 작업에 대응한 소형 스테이션 타입의 자동온조 납땜
시스템입니다. 인간공학적으로도 충분히 검토되어 확실한 안정된 납땜과 함께 양호한 작업성을 약속 합니다.
■특징 ·소형 PCB와 소형 부품의 납땜
작업에 적절하고 있습니다. ·최대 입력 200 W의 신설계의 세라믹 히터와 퀵 히트 회로의 채용으로, 경이적인 첫 시작 특성과
열회복력을 갖추고 있습니다. ·중천 히터의 채용으로 장시간, 최고의 절연을 유지합니다. ·미세한 납땜으로부터 일반 작업까지, 각종의
팁이 준비되어 있습니다. 또 장기 수명화이기 때문에 철도금을 종래의 2배(500미크론)로
했습니다.
The RD-500 Area Array Rework machine by Den-on Instruments for the safe Removal and Replacement of BGA,CSP, LGA, QFP, PLCC and other
components.
FOR STABLE AND SAFE
REWORK
-
High powered upper and
lower hot air heaters.
-
IR area heating
system.
-
Complete PC control and
auto-profilimg software.
-
Integrated component
preparation system.
-
Semi-auto placement.
Extensive safety features.
SUMMARY
Both the RD-500 and the
RD-500S were designed with high power top and bottom hot air heaters for local
heating of the components and board during rework. It also has an optional IR
area heaters on the bottom to prevent warpage of the Printed Circuit Board
during the rework process. This highly efficient heating system is especially
useful when reworking BGAs, CSPs, and other area array components that need to
be attached with Lead-Free solder. The heating system is computer controlled
for accuracy and the heat profile is created automatically via built-in
Auto-profiling software. The component is picked up with a single click of
the mouse button and is then held inside the nozzle during placement. This
eliminates any of the troublesome handling of the component during rework.
The alignment is then competed by viewing the board and the component array
simultaneously with a prism image picked up by a CCD camera. This image is then
fed into the computer via a high-resolution video capture card. The picture is
then viewed on the built-in video monitor. For large components the screen can
also be split in order to make the viewing and placement easier. The
component is then placed automatically with a single force setting of between
70-100 grams. This is achieved with a friction fitting that is overcome
by the downward placement of the component on the board. This ensures that the
component is placed with enough force to overcome the surface tension of the
flux or paste, but is low enough to that is prevents damage to thinner more
delicate components. The board holder can hold a maximum board size of
400mm~420mm ideal for network, server, and other large boards. The board holder
can also be easily adjusted to hold even smaller boards like mobile phones,
memory cards, etc. When smaller boards are used, any or all of the IR area
heaters can be shut off in order to save energy.The heat profile is
controlled through five zones with independent adjustment capability for all
three heaters. This gives additional flexibility when creating, modifying or
updating any profile. The software program and profile information is stored in
a Windows ME or XP ¦ version computer making it readily accessible. All these
features are combined to make the RD-500 one of the most simple, efficient, and
price competitive Area Array Rework systems on the market
today.
Large Board Rework Solution
for Eutectic and Lead Free Assemblies
Remove, Replace and Clean BGA / SMT Components for both
Eutectic and Lead Free Solders
offers cost effective manual and semi-automated BGA / SMT rework stations,
from DEN-ON Instruments, a worldwide leader of rework stations and soldering
tools.
RD-500 Semi-Automated Large Board BGA / SMT Rework
Station
System Overview
The RD-500 is a semi-automated single
axis placement and reflow station for BGA / SMT rework. Using advanced computer
control technology, the RD-500 rework station will meet the most demanding
applications, including lead free rework.
Lead-Free Rework
Capabilities
Handles boards Up 500 mm x 600 mm | 20" x 24"
Handles component sizes as small as 0.5mm
(0.02") up to 60mm (2.63")
Designed for lead-free and eutectic rework
Dual Point Auto-profiling software - to minimize the delta between the ball and topside
package temperature.
Efficient 3-point heating technology - provides highly efficient localized heating and
maximum performance for critical lead-free rework applications.
Multi-Stage localized hot air heaters deliver
controlled temperatures up to 510°C | 950°F
Infrared Bottom Heater delivers controlled
full board temperatures up to 510°C | 950°F
Rules-based profile verification - for
precise time and temperature control
Accurate placement (+/-0.025mm | +/-0.00098")
using high-resolution (autofocus) digital split-imaging vision technology
Uses standard or Nitrogen gas
Delivers repeatable process through advanced
controls
Process / data logging
Self-contained
Lead-free proven (designed for lead-free and
eutectic solders)
Key Advantages
Lead free by design
Price performance of the machine
Heating control within +/- 5 ° C
Time / temperature efficient (Die / Package temperature control)
Placement capability (Accuracy / Repeatability)
Ease of setup, including auto-profile software
Flexible board holders (odd shape, small)
Exceeds (industry standards) of 10° C thermal uniformity within the nozzle
Compact & self contained
Standard Board Rework Solution for
Eutectic and Lead Free Assemblies
Remove, Replace and Clean BGA / SMT Components for both
Eutectic and Lead Free Solders
offers cost effective manual and semi-automated BGA / SMT rework stations,
from DEN-ON Instruments, a worldwide leader of rework stations and soldering
tools.
RD-500SH Semi-Automated Standard Board
BGA / SMT Rework Station
System Overview
The RD-500SH is a semi-automated
single axis placement and reflow station for BGA / SMT rework. Using advanced
computer control technology, the RD-500SH rework station will meet the most
demanding applications, including lead free rework .
Lead-Free Rework
Capabilities
Handles boards Up 400 mm x 420 mm | 16" x
17"
Handles component sizes as small as 0.5mm
(0.02") up to 60mm (2.63")
Designed for lead-free and eutectic rework
Dual Point Auto-profiling software - to minimize the delta between the ball and topside
package temperature.
Efficient 3-point heating technology - provides highly efficient localized heating and
maximum performance for critical lead-free rework applications.
Multi-Stage localized hot air heaters deliver
controlled temperatures up to 510°C | 950°F
Infrared Bottom Heater delivers controlled
full board temperatures up to 510°C | 950°F
Rules-based profile verification - for
precise time and temperature control
Accurate placement (+/-0.025mm | +/-0.00098")
using high-resolution (autofocus) digital split-imaging vision technology
Use standard or Nitrogen gas
Delivers repeatable process through advanced
controls
Process / data logging
Self-Contained
Lead-free proven (designed for lead-free and
eutectic solders)
Small Board
Rework Solution for Eutectic and Lead Free
Assemblies
Remove, Replace and Clean BGA / SMT Components for both
Eutectic and Lead Free Solders
offers cost effective manual and semi-automated BGA / SMT rework stations,
from DEN-ON Instruments, a worldwide leader of rework stations and soldering
tools.
RD-500S Semi-Automated Standard Board BGA / SMT Rework Station
System Overview
The RD-500S is a semi-automated single
axis placement and reflow station for BGA / SMT rework. Using advanced computer
control technology, the RD-500S rework station will meet the most demanding
applications, including lead free rework. The RD-500S is focused on small board
rework applications such as cell phone, PDA, pager, and other miniature consumer
electronic surface mount boards.
Lead-Free Rework
Capabilities
Handles boards Up 102 mm x 152 mm | 4" x 6"
(or 16" x 17" with added heater) see RD-500SH
Handles component sizes as small as 0.5mm
(0.02") up to 60mm (2.63")
Designed for lead-free and eutectic rework
Dual Point Auto-profiling software - to minimize the delta between the ball and topside
package temperature.
offers cost effective manual and semi-automated BGA / SMT rework stations,
from DEN-ON Instruments, a worldwide leader of rework stations and soldering
tools.
RD-300 Manual BGA / SMT Rework
Station
System Overview
The RD-300 is a single
axis placement and reflow rework station designed for both Area Array and
standard leaded SMD components. The optics allow for accurate placement with a
high-resolution microscope and dual prism system with excellent color clarity.
This was designed to place the smallest of Area Array components like CSP and
flip chips. The reflow controller uses an infrared bottom heater and a hot air
top heater to precisely reflow the target component safely and accurately. It
also has a large memory to store up to 40 different profiles with two of these
already loaded in the system.
Lead-Free Rework
Capabilities
Handles boards up to: 300mm x 420mm | 11" x
18"
Self contained air and vacuum pump
Easy temperature profiling
Hot air top heater delivers up to 510°C |
950°F
Infrared bottom heater delivers up to 510°C |
950°F
Standard air or Nitrogen Gas
Accurate repeatable placement capability using a
high-resolution Microscope
Entry-Level Manual BGA / SMT Rework
Solution to Meet Your Needs
offers cost
effective manual and semi-automated BGA / SMT rework stations, from DEN-ON
Instruments, a worldwide leader of rework stations and soldering
tools.
SD-3000 Spot Air "Convective" Rework
Station
Lead-Free Rework
System Overview
The SD-3000 is a highly versatile,
easy to use, spot air soldering/de-soldering system that does not require
nozzles. Capable of removing any type of surface mount component, including BGA
devices, and surface mount connectors up to 2" (50mm) long. The SD-3000 can also
be used to install most SMT packages.
The unique hot air nozzle traces the
outside edge of the component or the top of an entire BGA evenly spreading heat
to the soldered area. Once reflow is achieved, the nozzle lifts out of the way
and the operator removes the component with a vacuum tip handle. This system can
even trace the line of hard to remove SMT connectors and switches. The hot air
nozzle has an adjustable motion range of up to 50mm (2 inches).
Capabilities
Handles Board Sizes up to : 16.5" wide and no
length limitations
Hot Air Top Heater delivers variable temperature
from 0-950º F
Compact design fits in to the tightest of work
areas
Simple table design allows for quick set up of
nearly any PCB
Standard board support to hold up larger PCBs from
the bottom to prevent warping or sagging
Standard heat containment rings prevent heat from
reflow the area around the target component
Optional IR pre-heater (PH-3100A) for the repair of
larger multi-layer PCBs
Thru-Hole/SMT Programmable Solder
Cleaner
for Site Dressing (scavenging)
and Component Clean-up
offers cost effective manual and
semi-automated BGA / SMT rework stations, from DEN-ON Instruments, a worldwide
leader of rework stations and soldering tools.
SC-200
Thru-Hole/SMT
Programmable Solder Cleaner
Product Overview
The SC-200 employs a hot air heating
which is used to preheat the area to be soldered prior to contacting the solder
joint or pad which greatly reduces the chance of overheating and lifting the pad
areas being reworked. This feature also prevents the tip from cooling during
desoldering and nearly eliminates clogging caused by cooled solder.
Part No. SC-200 (internal pump) N2
cabable
Specifications
Power
100-120VAC or 230VAC
Power Consumption
130W Max
Air Supply
Internal Dual Diaphragm
Pump
N2
6mm Diameter Tube ~0.1
Mpa
Hot Air or N2
2.0~2.5 L/min.
Dimensions
H5" x W5" x D9.25" H130mm x W130mm x
D235mm
Weight
8.75 Lbs. or 5Kgs
Cord Length
78.75" or
2Meters
Capabilities
Unique High Power (120 Watts) Heating
System With 120 watt heating element,
this solder cleaner has the power to keep the tip within range of the set
temperature during the heaviest SMT continuous cleaning.
Unique Dual Hot Air/Hot Tip Design The SC-200 & SC-300 employ a hot air heating which
is used to preheat the area to be soldered prior to contacting the solder joint
or pad which greatly reduces the chance of overheating and lifting the pad areas
being reworked. This feature also prevents the tip from cooling during
de-soldering and nearly eliminates clogging caused by cooled solder.
N2 Capable Both the SC-200 (internal pump) and the SC-300 (shop
air/venturi) systems are equipped to handle N2. The use of N2 provides a
semi-inert environment that will cause less oxidation during de-soldering. This
also helps to prevent oxidation, thereby increasing tip performance and life.
De-Soldering Hand Tool
Recognized
Worldwide as the Best De-Soldering Hand tool
offers cost effective manual and
semi-automated BGA / SMT rework stations, from DEN-ON Instruments, a worldwide
leader of rework stations and soldering tools.
SC-7000Z De-Soldering Hand Tool
Product Overview
The SC-200 & SC-300 employ a hot
air heating which is used to preheat the area to be soldered prior to contacting
the solder joint or pad which greatly reduces the chance of overheating and
lifting the pad areas being reworked. This feature also prevents the tip from
cooling during desoldering and nearly eliminates clogging caused by cooled
solder.
Part No. SC-200 (internal pump) N2
capable
Capabilities
Direct connection between the diaphragm pump and the tip provides high
vacuum efficiency capable of reworking 8-12 layered PCBs.
The combination of a 100W ceramic heater with sensor feedback temperature
control circuit and high vacuum capacity can provide best work efficiency with
no failure
Protection against ESD is secured
Quite compact, Lightweight unit portable and ready to use at any
location
Low noise and low vibration
The removal of SMD components can be easily done by a flick of the selector
lever and by replacing the tip with the hot blow nozzle
Confirmed Safety Standards
COUNTRY
STANDARD REFERENCE
CODE
U.S.A.
MIL STD-2000
GERMANY
TUV
CANADA
CSA
AUSTRALIA
AS
SWITZERLAND
SEV
SWEDEN
SEMCO
DENMARK
DEMCO
FINLAND
FEMCO
JAPAN
SAFETY
STD
Ultra Compact Digital Soldering Station
offers cost
effective manual and semi-automated BGA / SMT rework stations, from DEN-ON
Instruments, a worldwide leader of rework stations and soldering
tools.
SS-8100D Ultra Compact Digital Soldering Station
Product Overview
The SS-8100D is an ultra compact
digital soldering iron station.
It was designed to work under the
highest loads with a user-friendly ergonomic design. The small station takes up
little bench space and programming for the temperature is performed with a
simple up/down switch.
A variety of tip geometries are available for
precise heat delivery in the most populated printed circuit boards.
Part No. SC-200 (internal pump) N2
capable
Capabilities
Lightweight ergonomic hand piece for extended
use without worker fatigue
Simple programmable digital station makes set-up quick and simple
Small station case takes up little bench space
Long lasting iron plated tips for lower running cost and minimized downtime
Over 10 tips available and custom tips available upon request to match any
board and component shape and size
ESD safe construction for ensured product safety
Specifications
Soldering Iron:
Heater Ceramic type, 24 Volt MAX 200
Watt
Dimensions 201 mm long x 20 mm diameter at
grip area (does not include cord)
Weight 33 grams not including cord
Control Unit:
Available Voltages 100, 120 or 230
Power Consumption 80 Watts
Temperature Range 200-450C°450> ·
Dimensions 94 x 69 x 88 mm
Weight 1.2
Kg.
DEN-ON Nozzles - For both Eutectic
and Lead Free Solders
offers cost
effective nozzles and replacement part, from DEN-ON Instruments, a worldwide
leader of rework stations and soldering tools.
Nozzles RD-500
Series
Nozzle w/ Fixed Walls ANZ-07 to
ANZ-15
Part Number
Size (inside dimension)
millimeters
inches
ANZ-05
ANZ-07
ANZ-09
ANZ-13
ANZ-15
5x5 mm
0.22x0.63in
7x7mm
0.28x0.28
in
8x8mm
0.32x0.32
in
13x13mm
0.51x0.51
in
15x15mm
0.59x0.59
in
Nozzle w/ Adjustable Walls ANZ-18 to
ANZ-52
Part Number
Size (inside dimension)
millimeters
inches
ANZ-18
ANZ-20
ANZ-22
ANZ-24
ANZ-25
ANZ-25
ANZ-26
ANZ-28
ANZ-30
ANZ-32
ANZ-35
ANZ-37
ANZ-39
ANZ-40
ANZ-44
ANZ-49
ANZ-52
ANZ-53
ANZ-60
ANZ-66
18x18 mm
0.71x0.71
in
20x20mm
0.79x0.79
in
22x22mm
0.87x0.87
in
24x24mm
0.95x0.95
in
25x25mm
0.98x0.98
in
27x27mm
1.06x1.06 in
26x26mm
1.02x1.02
in
28x28mm
1.10x1.10
in
30x30mm
1.18x1.18
in
32x32mm
1.26x1.26
in
35x35mm
1.38x1.38
in
37x37mm
1.46x1.46
in
39x39mm
1.54x1.54
in
40x40mm
1.57 x 1.57 in
44x44mm
1.73x1.73
in
49x49mm
1.93x1.93
in
52x52mm
2.05x2.05
in
53x53mm
2.09x2.09
in
60x60mm
2.36x2.36
in
66x66mm
2.60x2.60
in
Micro Nozzle
Part Number
Size (inside dimension)
millimeters
inches
ANZ-05
5mm
0.20x0.20
in
Connector Nozzle
Part Number
Size (inside dimension)
millimeters
inches
TBD
TBD
19x59mm
0.75x2.3
in
Nozzle Kits, Component Holders and Board
Support Accessories
DEN-ON RD-500
Series Nozzle Kit
Nozzle kit carries complete range of nozzle sizes for RD-500 series
machines.
DEN-ON RD-500 Series Component
Die
Component die is used for presentation of parts to heating nozzle it
accommodates parts ranging from 10 mm to 50 mm
LGA775-Intel Processor Socket
and Component Rework Holder
FocalSpot designs and manufactures
standard and custom component holders to meet your specific
applications.
DEN-ON
RD-500 Series Small Board Holder
Small board carrier is used to accommodate pcbs 25 mm to 100
mm.
DEN-ON RD-500
Series Small Board Supports
Board Supports
FocalSpot designs and manufactures standard and
custom board supports to meet your specific applications.
DEN-ON
Instruments 공급 품목 :REWORK
SYSTEM : RD-500, RD-200PC, RD-300, RX-500 SOLDERING
TOOL : DS-500, SD-3000, SC-7000Z, SS-8200, SS-8100D
DEN-ON REWORK SYSTEM
SUMMARY
